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Thurs., April 5, 11 a.m.
ECSS 3.503

(Osborne Conference Room)

 

 

 

 

 

 

 me seminar

“Convective heat transfer at the micro scale”
Dr. Yoav Peles, Department of Mechanical, Aerospace and Nuclear Engineering,
Rensselaer Polytechnic Institute (RPI)

Abstract
Copious applications dissipating very high heat flux at ambient room temperature are becoming increasingly ubiquitous. Systems such as central processing unit (CPU), semiconductor laser diodes, and high concentrated photovoltaic (HCPV), to name a few, dissipate heat fluxes ranging from 10 W/cm2 to 1 kW/cm2. Traditional cooling methods, such as forced air cooling, cannot address these stringent cooling needs. Because of favorable scaling laws, research concerning enhanced heat transfer in diminishing length scales for high heat flux applications has been a topic of much interest in the last decade or so.    

In this presentation, the background and needs of research endeavors pertinent to convective heat transfer at the micro scale will be outlined.  Several examples of studies on single-phase flow and flow boiling in micro domains performed by our research group will be presented. A very notable deleterious phenomena prevalent at the micro scale — flow boiling instabilities— will be detailed and discussion.

  

Bio
Dr. Yoav Peles has been a professor in the Department of Mechanical, Aerospace, and Nuclear Engineering (MANE) at Rensselaer Polytechnic Institute (RPI) since 2002. His research at RPI mainly concerns heat transfer and fluid flow with emphasis on micro domains. Prior to joining RPI, he was a post-doctoral associate and later a research engineer at the Massachusetts Institute of Technology (MIT) working on miniature engines.

Professor Peles received his Ph.D. degree from the Mechanical Engineering Department at the Technion – Israel Institute of Technology. There he studied fundamental processes governing flow boiling in microchannels. He is the recipient of the 2005 ONR Young Investigator Award and the 2007 DARPA/MTO Young Faculty Award. As a member of the American Society of Mechanical Engineering (ASME) he has served on numerous professional committees, helped organize several conferences, and co-chaired and chaired the International Conference on Nanochannels, Microchannels, and Minichannels (ICNMM).